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  ? 2014 microchip technology inc. ds20005323a-page 1 hv9910c features switch mode controller for single switch led drivers enhanced drop-in replac ement to the hv9910b open loop peak current controller internal 15 to 450v linear regulator constant frequency or constant off-time operation linear and pwm dimming capability requires few external components for operation over-temperature protection applications dc/dc or ac/dc led driver applications rgb back-lighting led driver back lighting of flat panel displays general purpose constant current source signage and decorative led lighting chargers description hv9910c is an open-loop, current-mode control, led driver ic. this ic can be programmed to operate in either a constant frequency or constant off-time mode. it includes a 15 C 450v linear regulator which allows it to work with a wide range of input voltages without the need for an external low voltage supply. hv9910c includes a ttl-compatible, pwm-dimming input that can accept an external control signal with a duty ratio of 0 C 100% and a frequency of up to a few kilohertz. it also includes a 0 C 250mv linear-dimming input which can be used for linear dimming of the led current. unlike the hv9910b, the hv9910c is equipped with built-in thermal-shutdown protection. hv9910c is ideally suited for buck led drivers. since the hv9910c operates in open-loop current mode con- trol, the controller achieves good output current regula- tion without the need for any loop compensation. also, being an open-loop controller, pwm-dimming response is limited only by the rate of rise of the induc- tor current, enabling a very fast rise and fall times of the led current. hv9910c requires only three external components (apart from the power stage) to produce a controlled led current. this makes hv9910c an ideal solution for low-cost led drivers. universal high-brightness led driver downloaded from: http:///
hv9910c ds20005323a-page 2 ? 2014 microchip technology inc. to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publicat ions to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regard ing this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com . we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the vers ion number, (e.g., ds30000000a is version a of document ds30000000). errata an errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for curren t devices. as device/documen tation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a partic ular device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please spec ify which device, revision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 3 hv9910c pin diagram typical application circuit 8-lead soic 16-lead soic 12 3 4 5 6 7 8 1615 14 13 12 11 10 9 87 6 5 12 3 4 vin cs gnd gate rtld vdd pwmd vin ncnc cs gnd ncnc gate ncnc rt ld vdd nc nc pwmd c dd r osc r cs l1 q1 d1 c o c in hv9910c vin gate cs vddld pwmd rt gnd downloaded from: http:///
hv9910c ds20005323a-page 4 ? 2014 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings v in to gnd ...................................................... -0.5v to +470v v dd to gnd.......................................................................12v cs, ld, pwmd, gate...........................-0.3v to (v dd + 0.3v) junction temperature ....................................-40c to +125c storage temperature .....................................-65c to +150c continuous power dissipation (t a = +25c) 8-lead soic ...............................................650 mw 16-lead soic ...........................................1300 mw 8-lead soic with heat slug ......................1300 mw note : stresses above those listed under absolute maximum ratings may cause permanent dam age to the device. this is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operational listings of this specif ication, is not implied. expo- sure to maximum rating conditions for extended periods may affect device reliability. 1.1 electrical specifications table 1-1: electrical characteristics (sheet 1 of 2) 1 symbol parameter note min typ max units conditions input v indc input dc supply voltage range 2 3 15 - 450 v dc input voltage i in(max) supply current - - 0.8 1.5 ma pin pwmd to v dd , no capaci- tance at gate i insd shut-down mode supply current - - 0.5 1.0 ma pin pwmd to gnd internal regulator v dd internally regulated voltage - 7.25 7.50 7.75 v v in = 15v, i dd(ext) = 0, pwmd = v dd , 500pf at gate; r osc = 249k ? ? v dd , line line regulation of v dd -0-1 . 0v v in = 15 - 450v, i dd(ext) = 0, pwmd = v dd , 500pf at gate; r osc = 249k ? ? v dd , load load regulation of v dd -0-0 . 1v i dd(ext) = 0 - 1.0ma, pwmd = v dd , 500pf at gate; rosc = 249k ? uvlo v dd under voltage lockout threshold 3 6.45 6.70 6.95 v v dd rising ? uvlo v dd under voltage lockout hysteresis --5 0 0-m v v dd falling i in(max) maximum regulator current 4 5.0 - - ma v dd = uvlo - ? uvlo pwm dimming v en(lo) pwmd input low voltage 3 --1 . 0vv in = 15 - 450v v en(hi) pwmd input high voltage 3 2.4 - - v v in = 15 - 450v r en internal pull-down resis- tance at pwmd - 50 100 150 k ? v pwmd = 5.0v downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 5 hv9910c current sense comparator v cs current sense pull-in thresh- old voltage - 225 250 275 mv -40c < t a < +125c v offset offset voltage for ld com- parator 3 -12 - +12 mv t blank current sense blanking interval - 150 215 280 ns 0 < t a < +85c, v ld = v dd , v cs = v cs,th + 50mv after t blank - 145 215 315 -40 < t a < +125c, v ld = v dd , v cs = v cs,th + 50mv after t blank t delay delay to output - - 80 150 ns v in = 15v, vld = 0.15, v cs = 0 to 0.22v after t blank oscillator f osc oscillator frequency -2 02 53 0 khz r osc = 1.00m ? - 80 100 120 r osc = 249k ? gate driver i source maximum gate sourcing current -0 . 1 6 5- - av gate = 0v i sink maximum gate sinking cur- rent -0 . 1 6 5- - av gate = v dd t rise gate output rise time 4 -3 05 0n sc gate = 500pf t fall gate output fall time 4 -3 05 0n sc gate = 500pf over-temperature protection t sd shut-down temperature - 128 - 150 c ? t sd hysteresis - 10 - 30 c i sd t sd -mode v in current - - - 350 a 1 specifications are t a = 25c, v in = 15v unless otherwise noted. 2 also limited by package-power dissipation limit; whichever is lower. 3 applies over the full operating ambient temperature range of -40c < t a < +125c. 4 for design guidance only. table 1-1: electrical characteristics (continued) (sheet 2 of 2) 1 symbol parameter note min typ max units conditions table 1-2: thermal resistance package ja 8-lead soic 101c/w 16-lead soic 83c/w 8-lead soic (with heat slug) 84c/w downloaded from: http:///
hv9910c ds20005323a-page 6 ? 2014 microchip technology inc. 2.0 pin description the descriptions of the pins are listed in table 2-1 . table 2-1: pin description pin # function description 8-lead soic 16-lead soic 1 1 vin input of an 15 - 450v linear regulator. 2 4 cs current sense pin used to sense the fet current by means of an external sense resistor. when this pin exceeds the lower of either the internal 250mv or the voltage at the ld pin, the gate output goes low. 3 5 gnd ground return for all internal circuitry. must be electrically con- nected to the power ground. 4 8 gate output gate driver for an external n-channel power mosfet. 5 9 pwmd ttl-compatible, pwm-dimming input of the ic. when this pin is pulled to gnd or left open, the gate driver is turned off. when the pin is pulled high, the gate driver operates normally. 6 12 vdd power supply pin for all internal circuits. it must be bypassed with a low esr capacitor to gnd ( 0.1 f). 7 13 ld linear-dimming input and sets the current sense threshold as long as the voltage at the pin is less than 250mv (typ). 8 14 rt sets the oscillator frequency. when a resistor is connected between rt and gnd, the hv9910c operates in constant fre- quency mode. when the resistor is connected between rt and gate, the ic operates in constant off-time mode. - 2, 3, 6, 7, 10, 11, 15, 16 nc no connection downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 7 hv9910c 3.0 application information hv9910c is optimized to drive buck led drivers using open-loop, peak-current mode control. this method of control enables fairly accurate led current control without the need for high side current sensing or the design of any closed loop controllers. the ic uses very few external components and enables both linear and pwm-dimming of the led current. a resistor connected to the rt pin programs the fre- quency of operation (or the off-time). the oscillator pro- duces pulses at regular intervals. these pulses set the sr flip-flop in the hv9910c which causes the gate driver to turn on. the same pulses also start the blank- ing timer, which inhibits the reset input of the sr flip flop and prevents false turn-offs due to the turn-on spike. when the fet turns on, the current through the induc- tor starts ramping up. this current flows through the external sense resistor, r cs , and produces a ramp volt- age at the cs pin. the comparators are constantly comparing the cs pin voltage to both the voltage at the ld pin and the internal 250mv. once the blanking timer is complete, the output of t hese comparators is allowed to reset the flip-flop. when the output of either one of the two comparators goes high, the flip-flop is reset and the gate output goes low. the gate goes low until the sr flip-flop is set by the oscillator. assuming a 30% ripple in the inductor, the current sense resistor r cs can be set using: constant frequency peak current mode control has an inherent disadvantage C at duty cycles greater than 0.5, the control scheme goes into subharmonic oscilla- tions. to prevent this, an artificial slope is typically added to the current sense waveform. this slope com- pensation scheme will affect the accuracy of the led current in the present form. however, a constant off- time peak current control scheme does not have this problem and can easily op erate at duty cycles greater than 0.5. this control scheme also gives inherent input voltage rejection, making the led current almost insensitive to input voltage variations. however, this scheme leads to variable frequency operation and the frequency range depends grea tly on the input and out- put voltage variation. using hv9910c, it is easy to switch between the two modes of operation by chang- ing one connection (see section 3.3 oscillator ). 3.1 input voltage regulator hv9910c can be powered directly from its v in pin and can work from 15 - 450vdc at its v in pin. when a volt- age is applied at the v in pin, hv9910c maintains a constant 7.5v at the v dd pin. this voltage is used to power the ic and any external-resistor dividers needed to control the ic. the v dd pin must be bypassed by a low-esr capacitor to provide a low impedance path for the high frequency current of the output gate driver. hv9910c can also be operated by supplying a voltage at the v dd pin greater than the internally regulated volt- age. this will turn off the internal linear regulator of the ic and the hv9910c will operate directly off the voltage supplied at the v dd pin. this external voltage at the v dd pin should not exceed 12v. although the v in pin of the hv9910c is rated up to 450v, the actual maximum voltage that can be applied is limited by the power dissi pation in the ic. for exam- ple, if an 8-lead soic hv9910c (junction to ambient thermal resistance r j-a = 101c/w) draws about i in = 2.0ma from the v in pin, and has a maximum allowable temperature rise of the junc tion temperature limited to ? t = 75c, the maximum voltage at the v in pin would be: in these cases, to operate hv9910c from higher input voltages, a zener diode can be added in series with the v in pin to divert some of the power loss from hv9910c to the zener diode. in the above example, using a 100v zener diode will allow the circuit to easily work up to 450v. the input current drawn from the v in pin is a sum of the 1.5ma (maximum) current drawn by the internal circuit and the current drawn by the gate driver. the gate driver depends on the switching frequency and the gate charge of the external fet. in the above equation, f s is the switching frequency and q g is the gate charge of the external fet, which can be obtained from the data sheet of the fet. 3.2 current sense the current sense input of hv9910c goes to the non- inverting inputs of two comparators. the inverting ter- minal of one comparator is tied to an internal 250mv reference, whereas the inverting terminal of the other comparator is connected to the ld pin. the outputs of both these comparators are fed into an or gate and r cs 0.25v orv ld ?? 1.15 i led ? ------------------------------------ = note: the zener diode will increase the mini- mum input voltage required to turn on the hv9910c to 115v. v in max ?? ? t r ? ja ---------- - 1 i in ----- - ? 75 ? c 101 ? cw ? -------------------------- - 1 2ma ------------ - ? 371v = = = i in 1.5ma q g f s ? + = downloaded from: http:///
hv9910c ds20005323a-page 8 ? 2014 microchip technology inc. the output of the or gate is fed into the reset pin of the flip-flop. thus, the comp arator which has the lowest voltage at the inverting terminal determines when the gate output is turned off. the outputs of the comparators also include a 150- 280ns blanking time which prevents spurious turn-offs of the external fet due to the turn-on spike normally present in peak-current mode control. in rare cases, this internal blanking might not be enough to filter out the turn-on spike. in these instances, an external rc fil- ter needs to be added between the external sense resistor (rcs) and the cs pin. please note that the comparat ors are fast (with a typi- cal 80ns response time). a proper layout minimizing external inductances will prevent false triggering of these comparators. 3.3 oscillator the oscillator in hv9910c is controlled by a single resistor connected at the rt pin. the equation govern- ing the oscillator time period t osc is given by: if the resistor is conn ected between rt and gnd, hv9910c operates in a constant frequency mode and the above equation determines the time period. if the resistor is connected between rt and gate, hv9910c operates in a constant off-time mode and the above equation determines the off-time. 3.4 gate output the gate output of the hv9910c is used to drive an external fet. it is recommended that the gate charge of the external fet be less than 25nc for switching fre- quencies 100khz and less than 15nc for switching frequencies > 100khz. 3.5 linear dimming the linear dimming pin is used to control the led cur- rent. there are two cases when it may be necessary to use the linear dimming pin. 1. in some cases, when using the internal 250mv, it may not be possible to find the exact r cs value required to obtain the led current. in these cases, an external voltage divider from the v dd pin can be connected to the ld pin to obtain a voltage (less than 250mv) corresponding to the desired voltage across rcs. 2. linear dimming may be desired to adjust the current level to reduce t he intensity of the leds. in these cases, an external 0-250mv voltage can be connected to the ld pin to adjust the led current during operation. to use the internal 250mv, the ld pin can be con- nected to v dd . 3.6 pwm dimming pwm dimming can be achieved by driving the pwmd pin with a low frequency square wave signal. when the pwm signal is zero, the gate driver is turned off; when the pwmd signal if high, the gate driver is enabled. the pwmd signal does not turn off the other parts of the ic, therefore, the response of hv9910c to the pwmd signal is almost instantaneous. the rate of rise and fall of the led current is thus determined solely by the rise and fall times of the inductor current. to disable pwm dimming and enable the hv9910c permanently, connect the pwmd pin to v dd . 3.7 over-temperature protection the auto-recoverable thermal shutdown at 140c (typ.) junction temperature with 20c hysteresis is featured to avoid thermal runaway. when the junction tempera- ture reaches t sd = 140c (typ.), hv9910c enters a low power consumption shut-down mode with i in <350a. t osc ? s ?? r osc k ? ?? 25 -------------------------- - = note: although the ld pin can be pulled to gnd, the output current will not go to zero. this is due to the presence of a minimum on- time, which is equal to the sum of the blanking time and the delay to output time, or about 450ns. this minimum on-time causes the fet to be on for a minimum of 450ns, and thus the led current when ld = gnd is not zero. this current is also dependent on the input voltage, induc- tance value, forward voltage of the leds, and circuit parasitics. to get zero led cur- rent, the pwmd pin has to be used. downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 9 hv9910c figure 3-1: internal block diagram por 250mv vddgate vin ld cs gnd rt pwmd s r q blanking + - + - + - 1.25vbandgap reference otp oscillator downloaded from: http:///
hv9910c ds20005323a-page 10 ? 2014 microchip technology inc. 4.0 packaging information 4.1 package marking information 16-lead soic 8-lead soic x = product code yy = year sealed ww = week sealed nnn = traceability code e# = jedec symbol = pin 1 indicator note: the jedec environmental marking symbols (e#) illustrated are examples only, and might not reflect the actual value for the listed package code. downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 11 hv9910c figure 4-1: 8-lead soic (narrow body) package outline (lg) notes: 1. this chamfer feature is optional. a pin 1 identifier must be located in the index area indicated. the pin 1 identifier can be: a molded mark/identifier; an em bedded metal marker; or a printed indicator. 1 8 seating plane gauge plane l l1 l2 e e1 d e b a a2 a1 seating plane a a top view side view view b view b 1 note 1(index area d/2 x e1/2) view a-a h h note 1 symbol a a1 a2 b d e e1 e h l l1 l2 ? 1 dimension (mm) min 1.35* 0.10 1.25 0.31 4.80* 5.80* 3.80* 1.27 bsc 0.25 0.40 1.04 ref 0.25 bsc 0 5 nom - - - - 4.906.003.90 - - - - max 1.75 0.25 1.65* 0.51 5.00* 6.20* 4.00* 0.50 1.27 8 15 jedec registration ms-012, vari ation aa, issue e, sep 2005. * this dimension is not specified in the jedec drawing. ? this dimension differs from the jedec drawing. drawings not to scale. downloaded from: http:///
hv9910c ds20005323a-page 12 ? 2014 microchip technology inc. figure 4-2: 16-lead soic (narro w body) package outline (ng) notes: 1. this chamfer feature is optional. a pin 1 identifier must be located in the index area indicated. the pin 1 identifier can be: a molded mark/ident ifier; an embedded metal marker; or a printed indicator. top view side view view a-a view b a a seating plane 16 1 seating plane gauge plane l l1 l2 1 view b h h b a a2 a1 e e e1 d note 1(index area d/2 x e1/2) symbol a a1 a2 b d e e1 e h l l1 l2 ? 1 dimension (mm) min 1.35* 0.10 1.25 0.31 9.80* 5.80* 3.80* 1.27 bsc 0.25 0.40 1.04 ref 0.25 bsc 0 5 nom - - - - 9.906.003.90 - - - - max 1.75 0.25 1.65* 0.51 10.00* 6.20* 4.00* 0.50 1.27 8 15 jedec registration ms-012, vari ation ac, issue e, sep 2005. * this dimension is not specified in the jedec drawing. ? this dimension differs from the jedec drawing. drawings not to scale. downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 13 hv9910c figure 4-3: 8-lead soic (narrow body) package outline (sg) notes: 1. this chamfer feature is optional. a pin 1 identifier must be located in the index area indicated. the pin 1 identifier can be: a molded mark/identifier; an em bedded metal marker; or a printed indicator. 1 8 e e1 d e b a a2 a1 seating plane a a top view side view view b note 1(index area d/2 x e1/2) view a-a 8 1 bottom view d1 e2 exposed thermal pad zone seating plane gauge plane l l1 l2 view b 1 h h note 1 symbol a a1 a2 b d d1 e e1 e2 e h l l1 l2 ? 1 dimension (mm) min 1.25* 0.00 1.25 0.31 4. 80* 3.30? 5.80* 3.80* 2.29? 1.27 bsc 0.25 0.40 1.04 ref 0.25 bsc 0 5 nom - - - - 4.90 - 6.00 3.90 - - - - - max 1.70 0.15 1.55* 0.51 5.00* 3.8 1? 6.20* 4.00* 2.79? 0.50 1.27 8 15 jedec registration ms-012, vari ation ba, issue e, sep 2005. * this dimension is not specified in the jedec drawing. ? this dimension differs from the jedec drawing. drawings not to scale. downloaded from: http:///
hv9910c ds20005323a-page 14 ? 2014 microchip technology inc. appendix a: revision history revision a (august 2014) original release of this document. downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 15 hv9910c the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: product support C data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchips customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: distributor or representative local sales office field application engineer (fae) technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sa les offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support downloaded from: http:///
hv9910c ds20005323a-page 16 ? 2014 microchip technology inc. product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: hv9910c= universal high-brightness led driver package: lg = 8-lead soic ng = 16-lead soic sg = 8-lead soic with head slug environmental g = lead (pb)-free/rohs-compliant package reel: (nothing) = reel for lg and sg packages, tube for ng package m934 = reel for ng package examples: a) hv9910clg-g: 8-lead soic package, 2500/reel. b) hv9910cng-g 16-lead soic package, 45/tube c) hv9910cng-g-m934: 16-lead soic package, 2500/reel. d) HV9910CSG-G: 8-lead soic package with heat slug, 2500/reel. part no. x device x environmental x x package options reel - - downloaded from: http:///
? 2014 microchip technology inc. ds20005323a-page 17 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, th e microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered tradema rks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, a pplication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2014, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-63276-529-1 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality ? management ?? s ystem ? certified ? by ? dnv ? == iso/ts ? 16949 ? == ? downloaded from: http:///
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